GUANGZHOU TIANZEFIBER MATERIALS
PHOTONICS ADHESIVES
TIANZE organizes optical-device adhesives by assembly function: rigid positioning, strain relief, optical coupling, potting, fiber bonding and removable process protection.
APPLICATION EVALUATION
FAU head adhesive
TZ-FAH-101
A low-viscosity UV/thermal dual-cure adhesive for bonding the V-groove base and lid, with low shrinkage and a high glass-transition temperature.
Flexible FAU tail adhesive
TZ-FAT-206
A flexible UV-curable tail adhesive for securing the fiber transition region and relieving assembly strain.
Balanced FAU tail adhesive
TZ-FAT-208
A medium-hardness UV-curable tail adhesive balancing structural support with low-temperature flexibility.
Flexible coupling adhesive
TZ-PLC-301
A flexible, high-transmittance UV-curable adhesive for coupling and fixing PLC chips, AWG components and fiber arrays.
Low-shrinkage coupling adhesive
TZ-PLC-302
A high-transmittance UV-curable coupling adhesive with lower shrinkage and higher hardness.
Low-Tg coupling adhesive
TZ-PLC-303
A flexible, high-transmittance UV-curable coupling adhesive with a low glass-transition temperature for stress-sensitive assemblies.
Low-viscosity ferrule potting
TZ-FEP-401
A two-component, low-viscosity thermal-cure adhesive for ceramic ferrule and fiber patch-cord potting.
Controlled-flow ferrule potting
TZ-FEP-402
A semi-transparent, medium-to-high-viscosity thermal-cure adhesive for controlled-flow ferrule potting.
Water-soluble process protection
TZ-PRT-501
A UV-curable temporary protection material for fiber-array dicing, intended for subsequent water-soluble removal.
3316 fiber bonding adhesive
3316
A transparent, single-component UV-curable adhesive for optical-fiber bonding, coating and fiber-coil assembly.
IBR adhesive
An adhesive for intermittently bonded ribbon manufacturing, supporting flexible ribbon handling, rollability and access to individual fibers.
RELATED TECHNICAL GUIDES
TECHNICAL FAQ
Different locations can require different flow, rigidity, flexibility, cure and optical characteristics.
Define the material role, substrates, bond geometry, cure process, operating environment and finished-assembly tests.
No. Viscosity, cure, hardness, shrinkage, optical requirements and reliability conditions should be considered together.